3D Stacked Chips: From Emerging Processes to Heterogeneous - download pdf or read online

By Ibrahim (Abe) M. Elfadel,Gerhard Fettweis

This publication explains for readers how 3D chip stacks promise to extend the extent of on-chip integration, and to layout new heterogeneous semiconductor units that mix chips of alternative integration applied sciences (incl. sensors) in one package deal of the smallest attainable size.  The authors specialize in heterogeneous 3D integration, addressing essentially the most very important demanding situations during this rising expertise, together with contactless, optics-based, and carbon-nanotube-based 3D integration, in addition to signal-integrity and thermal administration matters in copper-based 3D integration. assurance additionally contains the 3D heterogeneous integration of energy resources, photonic units, and non-volatile stories in accordance with new fabrics systems.

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3D Stacked Chips: From Emerging Processes to Heterogeneous Systems by Ibrahim (Abe) M. Elfadel,Gerhard Fettweis


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